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本帖最后由 浩然wish 于 2016-4-17 21:29 编辑
http://www.neogaf.com/forum/showthread.php?t=1208682
台积电刚刚发布了他们2016年Q1季度财报,其中提到他们已经成功流片首批10nm FinFET工艺芯片,搭载该制程工艺的产品会在2017年第二季度大规模出货。对此台积电CEO刘德音谈到,某款未公开的游戏主机采用该制程芯片进行设计,但目前他们需要替客户进行保密。
10 nm design node for game console in mass production in 2017
Taiwan Semiconductor Manufacturing Company (TSMC) reveal 10nm node process for a game console in its quarterly earnings
The earnings for the first quarter 2016 also show what TSMC is up to. The tape out of the first chip in the 10FF process (10 nm FinFET) was successful in the first quarter of this year. Mass production in this process will ramp up in the second quarter 2017. Needless to say, TSMC kept its lips sealed about any possible customers for the node. TSMC CEO Mark Liu did, however, speak of a console design that will rely on this new process. As nothing else was said, one can wildly speculate what Sony, Microsoft or Nintendo are up to something behind sealed doors.
Will be interesting to see who jump to this process first, and by 2017 nonetheless. |
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